Solid State Science and Technology, Vol. 16, No 2 (2008) 119-128
Corresponding Author: firstname.lastname@example.org
REDUCTION OF DESIGN STEPS FOR STACKED DIE QFN USING OPTIMIZATION TECHNIQUE
N. N. Bachok, M. Z. M. Talib, I. Ahmad and I. Abdullah
Faculty of Engineering, Universiti Kebangsaan Malaysia,
43600 UKM Bangi, Selangor
Taguchi method has been shown to be successful in optimizing design parameters in the manufacturing industry. Finite element (FE) simulation, on the other hand, is used as a design tool and helps to reduce design time and cost. In this paper, the finite element analysis and Taguchi method were combined to aid in the design steps and to optimize the design parameters of Quad Flat No-Lead (QFN) stacked die package. Control factors of bottom die area and thickness, bottom epoxy thickness, top die area and thickness and top epoxy thickness of QFN package design were evaluated with finite element analysis. Both shear and principal stresses results were used as the evaluation variables. The results were then subjected to the Taguchi method to determine the optimal design parameters and to produce predicted stresses values. The predicted stresses results were then successfully verified with FE simulation.
. I. Anjoh, A. Nishimura, and S. Eguchi, (1998), Advanced IC Packaging for the Future Applications, IEEE Transactions on Electronic Devices, vol. 45, no. 3, pp. 743-752.
. J.H. Lau, (1997), Electronics Packaging Technology Update: BGA, CSP, DCA, and Flip Chip, 1997 IEMT/IMC Proceedings, pp. 32-36.
. T.A.C.M Claasen, (2003), System On a Chip: Changing IC Design Today and in The Future, IEEE Computer Society, pp. 20-26.
. G. Kuhnlein, A Design and Manufacturing Solution for High Reliable non-leaded CSP’s like QFN, Electronic Components and Technology Conference.
. T.Y.Tee, H.S. Ng, and J.L Diot, (2002) Comprehensive Design Analysis of
QFN and Power QFN Packages for Enhanced Board Level Solder Joint Reliability, 2002 Electronic Components and Technology Conference, pp. 985-991.
. D.G. Yang, K.M.B Jansen, L.J Earnst, G.Q Zhang, W.D.V Driel, H.J.L. Bressers and J.H.J Janssen, (2007), Numerical Modeling of Warpage Induced in QFN Array Molding Process, Microelectronics Reliability, vol. 47. pp. 310-318.
. K.B. Unchuwaniwala and M.F. Caggiano, (2001), Electrical Analysis of IC Packaging with Emphasis on Different Ball Grid Array Packages, 2001 Electronic Components and Technology Conference.
. T.Y. Tee, H.S. Ng, J.E. Luan, X. Zhang, K.Y. Goh, A.M. Grech, and R. Duca, (2005), 4-Dimensional Design Analysis and Optimization of System-in-Package. 2005 Electronics Packaging Technology Conference.
. C.C. Ng and G. Govindasamy, (2005), Thermal Simulation and Transient CFD Analysis of Stacked DIE QFN Package, 5th ASEAN ANSYS User Conference 2005, pp. 179-186.
. B.A. Zahn, 2002, Impact of Ball Via Configurations on Solder Joint Reliability in Tape Based Chip Scale Package, Electronics Components and Technology, pp. 1475-1483.
. X. Zhang and T.Y. Tee, (2004), Advanced Warpage Prediction Methodology for Matrix Stacked Die BGA during Assembly Processes,” 2004 Electronic Components and Technology Conference, pp. 593-399.
. C.L. Yeh and Y.S Lai, (2004), Transient Simulation of Solder Joint Fracturing Under Impact Test, 2004 Electronics Packaging Technology Conference, pp. 689-694.
. S.G. Jagarkal, M.M Hossain and D. Agonafer, (2004), Design Optimization and Reliability of PWB Level Electronic Package, 2004 Inter Society Conference on Thermal Phenomena, pp. 368-376.
. A.G. Siemens, Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules.
. R.K. Roy,(2001), Design of Experiments Using The Taguchi Approach” John Wiley & Sons Inc.
. D.C. Montgomery, (2001), Design and Analysis of Experiments, John Wiley & Sons Inc.
. G.S Peace, Taguchi Methods: A Hands On Approach, Addison- Wesley Publishing Company.
. R.G. Batson and M.E. Elam, (2002) Robust Design : An- Experiment- Based Approach to Design for Reliability, Maintenance and Reliability Conference (MARCON).