Solid State Science and Technology, Vol. 16, No 2 (2008) 15-24

ISSN 0128-7389

Corresponding Author:



V. Lim1, I. Ahmad1, N. Amin1, C.S. Foong2, T.L. Wong2 and R. Rasid3

1 Department of Electrical, Electronics and System, Faculty of Engineering,

Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor

2 Freescale Semiconductor, (M) Sdn. Bhd, No. 2, Jalan SS 8/2

Free Industrial Zone Sungei Way, Petaling Jaya 47300 Selangor

3 School of Applied Physics, Faculty of Science and Technology,

Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor



Nickel plated copper heat spreader acts as a medium to dissipate heat from silicon die towards heat-sink. Electroless nickel plating requires catalytic activation before the nickel can be deposited onto copper. Different catalytic activation techniques such as galvanic initiation and thin nickel-copper electrodeposition have diverse impact on the thermal performance of the heat spreader. Surface roughness of heat spreader was studied using Infinite Focus Microscope. High temperature storage test was also run to investigate intermetallic diffusion between the nickel and copper layers. This study found out that nickel-copper layer grew after high temperature storage condition. Furthermore, heat spreader with thin nickel-copper electrodeposition also gave a smoother surface.



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