Solid State Science and Technology, Vol. 16, No 2 (2008) 189-197
Corresponding Author: email@example.com
INVESTIGATION OF WARPAGE INDUCED ON MOLDED STRIP
OF QFN PACKAGE
U. Mokhtar1, R. Rasid1, I. Ahmad1, Z. Endut2, S. Esa2 and K. Krishnasamy2
1Advanced Semiconductor Packaging (ASPAC) Research Laboratory,
Universiti Kebangsaan Malaysia,
43600 UKM Bangi, Selangor, Malaysia
2AIC Semiconductor Sdn. Bhd.,
Kulim Hi-Tech Park, Kulim, Kedah, Malaysia.
Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects the package sawing process, and cause reliability issues. The main cause of warpage of area array packages is the coefficient thermal expansion (CTE) mismatch between the moulding compound and other components inside the package. The objective of this study is to investigate the warpage induced on the moulded strip of QFN package, by using different mold compounds which have different CTE values. The effect of thermal properties and filler content is also investigated. In this study, the QFN strips are moulded with different mould compounds. Nonlinear large deformation finite element analysis is performed to compare with the experimental result. It shows that different mould compound properties will result in different warpage.
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