Solid State and Technology, Vol. 16, No 2 (2008) 240-246
Corresponding Author: email@example.com
EFFECTS OF THERMAL AGING ON INTERMETALLIC COMPOUNDS AND VOIDS FORMATION IN AuAl WIRE BONDING
A. Jalar, M. F. Rosle and M. A. A. Hamid
School of Applied Physics, Faculty of Science and Technology,
Universiti Kebangsaan Malaysia
43600 UKM Bangi, Selangor
There are several issues related to the mechanical and electrical wirebond failure during wirebonding process. Major factors are associated with AuAl intermetallic system. AuAl intermetallic compounds (IMC) can easily form at room temperature and can be accelerated with the elevated temperature. In this paper, pattern of intermetallic compounds growth and potential degradation due to voids in thermosonic ball bonding were studied on AuAl intermetallic compounds. The thermosonic ball bonding process used 99.99% gold wire and aluminized pad of Si chip. Results after HTS at 150ēC for 500 hours demonstrated that voids were generated around the diffusion layer because of the Kirkendall effect and severe voids was clearly exhibited after thermal aging at 150ēC for 1000 hours. Prolong aging time can lead to bonding failure associate with Kirkendall voids.
. H.S. Chang, K.C. Hsieh, T. Marte s and A. Yang, (2004); Wirebond Void Formation During High Temperature Aging, TCPT, 27, 155-160.
 G.G. Harman, (1997); Wire Bonding in Microelectronics, Materials, Processes, Reliability and Yield, 2nd, McGraw-Hill USA
 E. Philofsky, (1970) Intermetallic Formation in Gold-Aluminium Systems, Solid state electronics, 13, 1391-1399.
 M. Hansen, (1958); The Constitution and C.J. Vath III, (2003); An Analysis of of Binary Phase Diagrams, 2nd, McGraw-Hill New York.
 . S. Murali, N. Srikanth and C.J. Vath III, (2003); An Analysis of Intermetallis Formation of Gold and Copper Ball Bonding on Thermal Aging, Mater. Res. Bull, 38, 637-646.
. K. Dittmer, S. Kumar and F. Wulff, (1999); Influence of Bonding Conditions on Degradation of Small Ball Bonds Due to Intermetallic Phase (IP) Growth, Proceeding of Intl. Conf. on High Density Pack. And MCMs, 403-408.