Solid State Science and Technology, Vol. 16, No 2 (2008) 247-254

 ISSN 0128-7389

Corresponding Author:




S. Abdullah, Z.A. Aziz, I. Ahmad, M.F. Abdullah and M.F. Mod Yunoh

Faculty of Engineering, Universiti Kebangsaan Malaysia,

43600 UKM Bangi, Selangor.



The deflection of gold wire bonds during encapsulation of IC packaging can seriously cause wire crossover and shorting. This paper presents the wire looping formation in affecting the wire sweep in Quad Flat No Lead (QFN) packages. The design of experiment was performed using the 2k factorial method. Three looping parameters were considered in order to perform nine combinations of looping formations, and these looping parameters are kink height, reverse motion and loop factor. In order to get the most effected factor for wire sweep, the analytical method was applied using the specific statistical software. The results showed the maximum value of kink height and loop factor gave the lowest sweep stiffness. It was also found that the looping formation with higher loop height and wire payout gave the higher readings of wire sweep.



[1]. H.K. Kung, C.H. Huang and A.I. Chanyshev, (2006); On the Study of Loop Profiles in Improving the Sweep Stiffness of Wire Bond, Electronics Packaging Technology Conference.

[2]. H.K. Kung and B.W. Huang, (2006); High-Temperature Wire Sweep Characteristics of Semiconductor Package for Variable Loop Height Wire Bonding Technology Microelectronic Engineering, 83, 197–205.

[3]. L.T. Nguyen, (1988); Wire Bond Behavior during Molding Operations of Electronic Packages, Polymer Engineering Science, 28, 926-943.

[4]. L.T. Nguyen and F.J. Lim, (1990); Wire Sweep during Molding and Integrated Circuits, IEEE Pmc. Electron Comp. Conference, 1, 777-785.

[5]. M.K. Electron Co. Ltd., Summary of MKE’s Catalog (Au Wire Part).

[6]. D.C. Montgomery, (1997); Design and Analysis of Experiment Fifth Edition, John Wiley & Sons.

[7]. H.K. Kung, J.N. Lee and C.Y. Wang, (2005); The Wire Sweep Analysis Based on the Evaluation of the Bending and Twisting Moments for Semiconductor Packaging, Microelectronic Engineering