Solid State Science and Technology, Vol. 16, No 2 (2008) 25-32

ISSN 0128-7389

 Corresponding Author: 25



S. Abdullah, Z.A. Aziz, I. Ahmad and M.F. Abdullah

Faculty of Engineering, Universiti Kebangsaan Malaysia,

43600 UKM Bangi, Selangor, Malaysia.



Low looping in bonding wire is become more challenges in the current technology application of advanced packages. In an advanced application, the wire bond process is demanded 100μm low loop height for three dimensional stacked die packages. The purpose of applying the low loop wire bonding is to form the minimum overall package size. The growth of stacked die packages and its requirement for a low profile gives so many challenges the wire bonding process. This paper examines the capability of the low looping advancements in today’s wire bonder to meet the unique challenges associated with stacked die applications. It determines the factors that should be considered in the forming of the low looping using soft gold wire. The lowest achievable loop heights are physically constrained by the dimensions and plastics deformation behavior of the wire. The type of loop that has been used in this study is worked loop because it takes a short duration per bond and also the fastest. The demand for stacked die, die-to-die and multi-tiered packages have produced a demand for low loop in wire bonding process.




[1]. L. Hao, S.H. Ong and L.C. Tang, (1998), Robust Loop Parameters for Ball Neck Strength Enhancement, IEEE/CPMT Electronics Packaging Technology Conference, pp. 313-317

[2]. Saraswati, E.P.P. Theint, D. Stephan, F.W. Wulff, C.D. Breach and D.R.M. Calpito, (2004), Looping Behaviour of Gold Ballbonding Wire, Kulicke & Soffa (S. E. A) Pte. Ltd

[3]. S. Prasad, (2004), Advanced Wire Bond Interconnection Technology, Kluwer Academic Publishers, Boston.

[4]. D.R.M. Calpito, W. Ivy, E. Pasamanero, E.P.P. Theint and T.C. Wei, (2006), Very Long, Ultra-Low Loop Testing for New Bonding Wire Development, SEMICON® Singapore, pp. 1-8

[5]. R. Radke et al., (2001), The Challenge of Overcoming Wire Sweep in Ultra-Fine-Pitch Wire Bonded Ball Grid Array Packages, IMAPS 34th International Symposium on Microelectronics, Baltimore MD. pp. 266-271

[6]. H.K. Kung and B.W. Huang, (2005), High-Temperature Wire Sweep Characteristics of Semiconductor Packages for Variable Loop Height Wire Bonding Technology, Elsevier B. V.

[7]. Y. Alcobi, (2005), Stacked Die and Multi-tier Applications – New Capillary Adresses Looping Problem, PennWell Corporation.

[8]. M.K. Electron Co. Ltd., Summary of MKE’s Catalog (Au Wire Part).

[9]. B. Chylak, L. Levine, S. Babinetz and O.D. Kwon, (2006), Advanced Ultra-Low-Loop Wire Bonds, SEMICON® China.

[10]. Tanaka Enterprise, (2000), Catalog for Wire

[11]. TOSHIBA IT & Control System Corporation, (2002), TOSMICRON-S Series (for appraisal analysis)

[12]. G.G. Harman, (1996), Wire Bonding in Micro Electronics Materials, Processes, Reliability and Yield, 2th Edition, McGraw Hill, New York