Solid State Science and Technology, Vol. 16, No 2 (2008) 33-41

ISSN 0128-7389 Corresponding Author: wid_shualdi@yahoo.com 33

 FAILURE ANALYSIS OF POWER MOS DEVICE FROM THE BACKSIDE

OF THE DIE

W.M.S.W. Suliman1, W. Shualdi1, G. Kenny C.S.2 and A. Isnin 3

1Advanced Semiconductor Packaging (ASPAC) Research Laboratory

Universiti Kebangsaan Malaysia

43600 UKM Bangi, Selangor, Malaysia

2Failure Analysis Department, Infineon Technologies (Kulim) Sdn. Bhd.

09000 Kulim, Kedah, Malaysia

3Advanced Material Research Center (AMREC)

09000 Kulim, Kedah, Malaysia

 

ABSTRACT

Backside analysis has been developed as a useful tool for failure determination for quite some time. This method of analysis, used for debug and fault isolation required a limitless stretch of the imagination and creative solutions. The procedures used to gain access to the back of the target die for backside Photoemission Microscopy have created many unique and challenging solution of their own. With the speed of change, advancement and developments within the power semiconductor technology, multi layer metallization and shrink processes make traditional front or top side analysis technique more difficult and in most cases impossible. Technological advancement results in utilization of backside analysis technique to become an important tool for debug and fault isolation.

http://journal.masshp.net/wp-content/uploads/Journal/2008/Jilid%202/W.M.S.W.%20Suliman%2033-41.pdf

REFERENCES

[1]. D.L. Barton, K. Bernhard-Hofer and E.I. Cole Jr., (1999); FLIP-Chip and Backside Techniques, Microelectronic Reliability, 39, 721-730.

[2]. F. Beaudoin, G. Imbert, P. Perdu, C. Trocque, (2001); Current Leakage Fault Localization using Backside OBIRCH, Proceeding of 8th IPFA 2001, Singapore.

[3]. Z. Jianbai and R. Harrison, (2004); Backside Analysis Using Re-Package Techniques, Microelectronics Failure Analysis 5th Edition, 341-346.

[4]. L. Silke, (2000); Failure Analysis from the Backside of the Die, ISTFA Proc., 177-185.

[5]. N.M. Wu, K. Weaver and J.H. Lin, (1996); Failure Analysis from Backside of Die, ISTFA, 393-399.