Solid State Science and Technology, Vol. 16, No 2 (2008) 42-48
Corresponding Author: email@example.com 42
CHALLENGE IN FREE AIR BALLS FORMATION OF COPPER DURING THERMOSONIC WIRE BONDING PROCESS
A. Jalar and S.H.A. Razak
School of Applied Physics, Faculty of Science and Technology,
Universiti Kebangsaan Malaysia,
43600 Bangi, Selangor
Copper wire ball bonding has gained popularity recently due to its economic advantages and superior electrical and mechanical performances. Although it has great advantages compared to gold, however, it still not been widely used in industry because of some challenges that need to be addressed. One of the main challenges in this copper wire bonding process is to form a free air ball (FAB) without being oxidized. This paper reviews the difficulties and challenges that the semiconductor industries faced during copper wire bonding process in order to get the perfectly spherical and bright surface of FAB without signs of oxide scales.
. H.M. Ho, J. Tan, Y.C. Tan, B.H. Toh and P. Xavier, (2005); Modeling Energy Transfer To Copper Wire For Bonding In An Inert Environment. Electronic Packaging Technology Conference, EPTC. Proceedings of 7th. Vol 1. pp: 6.
. M. Deley, and L. Levine, (2004); The Emergence of High Volume Copper Ball Bonding. Electronics Manufacturing Technology Symposium, IEEE/CPMT/ SEMI 29th International. pp: 186-190.
. C. Hang, C. Wang, M. Shi, X. Wu and H. Wang, (2005); Study of Copper Free Air Ball in Thermosonic Copper Ball Bonding. IEEE 6th International Conference on Electronic Packaging Technology. pp: 414 - 418.
. H. Shouyu, H. Chunjing and W. Chunqing, (2006); Experimental Research of Copper Wire Ball Bonding. IEEE 6th International Conference on Electronic Packaging Technology. pp: 441-445.
. J. Tan, B.H. Toh, and H.M. Ho (2004); Modelling of Free Air Ball for Copper Wire Bonding. Electronics Packaging Technology Conference, EPTC. Proceedings of 6th. pp: 711-717.
. K. Toyozawa, K. Fujita, S. Minamide and T. Maeda, (1990); Development of Copper Wire Bonding Application Technology. IEEE transactions on components, hybrids, and manufacturing technology. Vol. 13, no. 4. pp: 762-767.