Solid State Science and Technology, Vol. 16, No 2 (2008) 92-98

ISSN 0128-7389

Corresponding Author: wid_shualdi@yahoo.com

 

CONSTRUCTIONAL ANALYSIS FOR QFN STACKED DIE FAILURE IDENTIFICATION

W. Shualdi1, W. M. S. W. Suliman1, A. Isnin2 and N. A. Mohamad2

1Advanced Semiconductor Packaging (ASPAC) Research Laboratory

Universiti Kebangsaan Malaysia

43600 UKM Bangi,Selangor, Malaysia

2Amrec Sirim Berhad

Kulim Hi-Tech Park

09000 Kulim, Kedah, Malaysia

 

ABSTRACT

The electronic industry has always set for the highest standards in quality and reliability. To ensure the reliability of final semiconductor products, evaluation and characterization at process development and product stage are conducted. In this paper, constructional analysis (CA) technique is used as a tool to determine failure mode in QFN stacked die package that will affect reliability. The procedure in CA involves package decapsulation, cross sectioning

 

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