Solid State Science and Technology, Vol. 16, No 2 (2008) 92-98

ISSN 0128-7389

Corresponding Author:



W. Shualdi1, W. M. S. W. Suliman1, A. Isnin2 and N. A. Mohamad2

1Advanced Semiconductor Packaging (ASPAC) Research Laboratory

Universiti Kebangsaan Malaysia

43600 UKM Bangi,Selangor, Malaysia

2Amrec Sirim Berhad

Kulim Hi-Tech Park

09000 Kulim, Kedah, Malaysia



The electronic industry has always set for the highest standards in quality and reliability. To ensure the reliability of final semiconductor products, evaluation and characterization at process development and product stage are conducted. In this paper, constructional analysis (CA) technique is used as a tool to determine failure mode in QFN stacked die package that will affect reliability. The procedure in CA involves package decapsulation, cross sectioning



[1]. D.M. Barry, C. Chrysanthou, and N.A. Weir, (2003); Failure Pattern Determination For Integrated Circuit Devices Using Wet-ChemicalDecapsulation and Statistical Reliability Modeling, Reliability Engineering, Vol.15(4), 283-298.

[2]. O. Froydis and S. Frode, (2004); Wire-bond Failure Mechanisms in Plastic Encapsulated Microcircuits and Ceramic Hybridsat High Temperatures, Microelectronics Reliability, Vol.44,(6), 1009-1015.

[3]. S. Ramminger, N. Seliger, and G. Wachutka, (2000); Reliability Model for AI Wire Bonds subjected to Heel Crack Failures, Microelectronics Reliability, Vol 40 (8-10), 1521-1525.

[4]. Z. Xiang, K. Carsten and K. Bernd, (2005); Automatic Classification of Defects on The Product Surface in Grinding and Polishing, International Journal of Machine Tools and Manufacture, Vol 46(1), 59-69.