Solid State Science and Technology, Vol. 16, No 2 (2008) 92-98
Corresponding Author: email@example.com
CONSTRUCTIONAL ANALYSIS FOR QFN STACKED DIE FAILURE IDENTIFICATION
W. Shualdi1, W. M. S. W. Suliman1, A. Isnin2 and N. A. Mohamad2
1Advanced Semiconductor Packaging (ASPAC) Research Laboratory
Universiti Kebangsaan Malaysia
43600 UKM Bangi,Selangor, Malaysia
2Amrec Sirim Berhad
Kulim Hi-Tech Park
09000 Kulim, Kedah, Malaysia
The electronic industry has always set for the highest standards in quality and reliability. To ensure the reliability of final semiconductor products, evaluation and characterization at process development and product stage are conducted. In this paper, constructional analysis (CA) technique is used as a tool to determine failure mode in QFN stacked die package that will affect reliability. The procedure in CA involves package decapsulation, cross sectioning
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