Volume 16 No 2, 2008

Volume 16 No 2, 2008
Solid State Science and Technology, Vol. 16, No 2, (2008)

STEREOMETRY OF VOIDS IN SOLDER INTERCONNECT BETWEEN PCB AND PACKAGING
A. Jalar, F. M. Nasir, M. A. A. Hamid, N. C. Had and N. Ismail

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 1-7

 

EFFECTS OF POWER AND FORCE DURING WIRE BONDING PROCESS ON WIRE PULL STRENGTH FOR QFN STACKED DIE
A. Jalar, S. H. A. Razak and M. A. A. Hamid

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 8-14

 

NICKEL PLATED COPPER HEAT SPREADER SURFACE CHARACTERISTICS
V. Lim, I. Ahmad, N. Amin, C. S. Foong, T. L. Wong and R. Rasid

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 15-24

 

LOW LOOPING CHALLENGES IN THE QFN WIRE BONDING PROCESS
S. Abdullah, Z. A. Aziz, I. Ahmad and M. F. Abdullah

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 25-32

 

FAILURE ANALYSIS OF POWER MOS DEVICE FROM THE BACKSIDE OF THE DIE
W. M. S. W. Suliman, W. Shualdi, G. Kenny C. S. and A. Isnin

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 33-41

 

CHALLENGE IN FREE AIR BALLS FORMATION OF COPPER DURING THERMOSONIC WIRE BONDING PROCESS
A. Jalar and S. H. A. Razak

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 42-48

 

EFFECT OF DIE CONFIGURATIONS ON WARPAGE ISSUES FOR QFN PACKAGES
A. E. Said, R. Rasid, S. Ahmad and U. Mokhtar

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 49-57

 

EFFECT OF THERMAL AGING ON THE IMC LAYER BETWEEN SNAGSB SOLDER AND CU SUBSTRATE
W. Shualdi, I. Ahmad, G. Omar and A. Isnin

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 58-64

 

EFFECT OF USG CURRENT AND BONDING LOAD ON BONDING FORMATION IN QFN STACKED DIE PACKAGE
A. Jalar , S. A. Radzi and M.A.A. Hamid

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 65-71

 

EFFECT OF PACKAGE DELAMINATION UNDER 3-POINTS BENDING TEST: A CASE STUDY USING CYCLIC LOADING
S.Abdullah, M.F.Abdullah, A.K.Ariffin, M.N.Baharin and Z.A.Aziz

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 72-82

 

EFFECT OF MOLDING COMPOUND AND DIE ATTACH ADHESIVE MATERIAL ON QFN PACKAGE DELAMINATION AND WARPAGE ISSUES
U. Mokhtar, R. Rasid, S. Ahmad, A. E. Said, F .L. A. Latip and C.C. Ng.

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 83-91

 

CONSTRUCTIONAL ANALYSIS FOR QFN STACKED DIE FAILURE IDENTIFICATION
W. Shualdi, W. M. S. W. Suliman, A. Isnin and N. A. Mohamad

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 92-98

 

TIN-BASED LEAD-FREE SOLDER BUMPS FOR FLIP-CHIP APPLICATION
S. Yaakup, H. S. Zakaria, M. A. Hashim and A. Isnin

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 99-108

 

SHEAR STRESS ANALYSIS OF DIFFERENT STACKED DIE QFN PACKAGE USING FEM
N. N. Bachok, M. Z. M. Talib and I. Abdullah

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 109-118

 

REDUCTION OF DESIGN STEPS FOR STACKED DIE QFN USING OPTIMIZATION TECHNIQUE
N. N. Bachok, M. Z. M. Talib, I. Ahmad and I. Abdullah

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 119-128

 

SOME ASPECTS ON FREE AIR BALL (FAB) FORMATION COPPER WIRE BONDING
A. Jalar and S. A. Radzi

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 129-133

 

STENCIL PRINTING TECHNIQUE FOR MICRO-SOLDER BUMPS PATTERNING
S. Yaakup, N. S. Shaari, W. N. W. Jaafar and M. A. Hashim

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 134-143

 

REDUCTION OF WARPAGE OCCURRENCE STACK-DIE QFN THROUGH FEA AND STATISTICAL METHOD
I. Abdullah, M. Z. M. Talib, I. Ahmad, M. N. B. C. Kamarudin and N. N. Bachok

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 144-152

 

WARPAGE AND WIRE SWEEP ANALYSIS OF QFN MOLDED ARRAY STRIP USING MODELING AND EXPERIMENTAL METHODS
I. Abdullah, I. Ahmad, M.Z. Meor Talib, N. Bachok, U. Mokhtar and A.E. Said

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 153-163

 

COOPER LEADFRAME ANALYSIS USING THERMOMECHANICAL APPROACH
S. Abdullah, M. F. Abdullah, A. K. Ariffin, S. Yusof, R. Daud and Z. A. Aziz

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 164-172

 

EFFECT OF ULTRASONIC ENERGY AND FORCE ON INTERMETALLIC GROWTH PATTERNS FOR 2N GOLD WIRE
A. Jalar and M. F. Rosle

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 173-179

 

EFFECTS OF PARAMETER MATCH ON BONDABILITY AND RELIABILITY IN THERMOSONIC GOLD BONDING
A. Jalar, M. F. Rosle and M. A. A. Hamid

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 180-188

 

INVESTIGATION OF WARPAGE INDUCED ON MOLDED STRIP OF QFN PACKAGE
U. Mokhtar, R. Rasid, I. Ahmad, Z. Endut, S. Esa and K. Krishnasamy

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 189-197

 

STEP CUT FOR DICING LAMINATED WAFER IN A QFN PACKAGE
S. Abdullah, S. M. Yusof, A. Jalar, M. F. Abdullah, Z. A. Aziz and R. Daud

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 198-206

 

DELAMINATION AND VOID ANALYSIS ON DIE ATTACH EPOXY OF A QFN PACKAGE
F. L. A. Latip, A. Hassan and R. Yahya

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 207-213

 

ANALYSIS ON GEOMETRY AND SURFACE OF 150 ┬Ám SILICON WAFER AFTER BACKGRINDING AND WET ETCHING PROCESS
M. R. Ismail, W. J. Basirun and Y. K. Tay

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 214-222

 

COMPARISON IN BETWEEN GOOD AND OXIDIZED LEADFRAME: A CASE STUDY IN PACKAGE DELAMINATION ANALYSIS
S. Abdullah, M. F. Abdullah, A. K. Ariffin, M. N. Baharin and Z. A. Aziz

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 223-231

 

GOLD WIRE NECK STRENGTH ON DIFFERENT COMBINATIONS OF LOOPING PARAMETERS
S. Abdullah, Z. A. Aziz, I. Ahmad and M. F. Abdullah

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 232-239

 

EFFECTS OF THERMAL AGING ON INTERMETALLIC COMPOUNDS AND VOIDS FORMATION IN AuAl WIRE BONDING
A. Jalar, M. F. Rosle and M. A. A. Hamid

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 240-246

 

EFFECTS OF LOOPING FORMATION IN WIRE SWEEPING PROBLEM OF A NEWLY DEVELOPED QFN PACKAGES.
S. Abdullah, Z. A. Aziz, I. Ahmad and M. F. Abdullah

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 247-254

 

COMPARISON OF 2K FACTORIAL AND TAGUCHI METHOD TO OPTIMIZE DESIGN PARAMETERS FOR QFN STACKED DIE
N. N. Bachok, M. Z. M. Talib, I. Ahmad and I. Abdullah

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 255-263

 

OPTIMIZATION OF PACKAGE SAW PARAMETERS USING FULL FACTORIAL DESIGN IN QFN PACKAGES
A. E. Said, R. Rasid, S. Ahmad and U. Mokhtar.

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 264-271

 

THE EFFECT OF DELAMINATION BETWEEN MOLD COMPOUND AND Ni/Pd/Au LEADFRAME ON QFN PACKAGE
A. E. Said, R. Rasid, S. Ahmad and J. Lim

Abstract & References > HTML > PDF
Open Access >Solid State Science and Technology, Vol. 16, No 2, (2008) 272-279

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